NAND Package Quality and Reliability Engineer

    • Cupertino, CA


Posted: Jan 30, 2020

Role Number: 200003142

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product This is a rare opportunity to showcase your skills in NAND memory package assembly, test, and system design. In this role you will demonstrate your career success and technical depth in leading external suppliers and driving items to closure across large multi-functional teams. At Apple we hire champions for quality and best-in-class product solutions.

Key Qualifications

  • Typically requires 7+ years in NAND flash memory assembly and test experience
  • Strong Flash Quality and Reliability experience
  • Experience with semiconductor package and test engineering
  • Strong Flash technical background Experience with NAND flash memory technology and processing is ideal
  • Experience with system level NAND flash engineering is a plus


As our NAND Assembly Test Q&R Engineer, you will conduct quality assessments, up to and including semiconductor vendor/CM sites audit. You'll perform statistical analysis to determine responsibility for NAND and MCP products that do not meet required specifications. In addition, you will be involved in determination of quality and reliability requirements of NAND and MCP to help define Apple's mass storage solutions for our current line of extraordinary products. Your work will have a direct technical impact on our what future product capabilities will be. - Responsible for communicating NAND vendors regarding NAND package and test related quality excursion, failure analysis, and corrective actions - Handling vendors NAND package qualification, manufacturing quality systems and methods, PCN control, Material Review Board for lot disposition, and Audit - Demonstrate strength in technical and analytical problem solving skills for package and test related quality issues - Support internal engineering and management teams in NAND package and test related failure analysis and defining corrective actions - Develop analytical tools and quality screens to assure the early identification of potential problems with new NAND products and new NAND MCP packaging - Building and maintaining a failure analysis workflow including CM's, vendors, and internal teams

Education & Experience

BS or MS Degree in technical discipline.

Additional Requirements

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