The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development and a particular chip bonding, 3D integration, Systems on Chip and Systems in Package who will aid in AWS's effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors.
Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in sound engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in wafer bonding, flip chip bonding, SoC and SiP techniques and tools. Working effectively within a team environment is critical.
The work/life integration within our team encourages a culture where employees work hard and also have ownership over their downtime.
Mentorship & Career Growth
We are committed to the growth and development of every member at the AWS Center for Quantum Computing. The candidate will receive management and mentorship from within the team that is geared toward career growth, and also have the opportunity to participate in Amazon's mentorship programs for engineers and scientists.
Inclusive and Diverse Culture
Here at AWS, we embrace our differences. We are committed to furthering our culture of inclusion. We have ten employee-led affinity groups, reaching 40,000 employees in over 190 chapters globally. We have innovative benefit offerings, and we host annual and ongoing learning experiences, including our Conversations on Race and Ethnicity (CORE) and AmazeCon (gender diversity) conferences. Amazon's culture of inclusion is reinforced within our 14 Leadership Principles, which remind team members to seek diverse perspectives, learn and be curious, and earn trust.
• BS in physics, applied physics, material science, electrical engineering or related field
• 2+ years of relevant industry experience (or equivalent lab experience in an MS or PhD program)
• Expertise in one or more of the following lithography processes and tools: Flip chip bonding tools, wafer bonding tools, SoC and SiP techniques.
• Good working knowledge in two or more of the following device fabrication areas: MEMS, photo lithography, ebeam lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition, epitaxy, CMP, process integration, and electron/ion/x-ray/scanning probe characterization tools
• Great problem solving and analytical skills
• Communication and data presentation skills
• Effective working in a team environment with other engineers, scientists and technicians who have a wide range of technical skill levels
• MS or higher in physics, applied physics, materials science, electrical engineering or related field
• Basic programming skills (e.g. Python, Julia, MATLAB)
• Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus
• Experience with quantum physics and quantum information technology is a plus
Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, visit https://www.amazon.jobs/en/disability/us .